脈沖鍍銅 OMG PC600 ppr 200 填通空 填盲孔 TGV TSV 

特性和優(yōu)點(diǎn)

1. MC-1200是一種酸性鍍銅添加劑系統(tǒng)，專門針對(duì)連續(xù)生產(chǎn)的脈沖周期性反整流進(jìn)行了優(yōu)化；

2. 這一過程產(chǎn)生了一種細(xì)粒的、韌性的、具有良好分布特征的沉積物，并由兩部分組成；

3. MC-1200和周期性反脈沖電鍍整流器的組合可以顯著縮短電鍍時(shí)間，同時(shí)保持良好的鍍銅層厚度分布比；

4. 尤其適合縱橫比在20:1的印制電路板；

1. MC-1200 is an acid copper plating additive system that has been specifically optimized for use with pulse periodic reverse rectification on a continual production basis；

2. The process produces a fine-grained, ductile deposit with excellent distribution characteristics, and is maintained with two components；

3. The combination of MC-1200 and a periodic reverse pulse plating rectifier can significantly shorten plating times while maintaining excellent copper thickness distribution ratios；

4. Especially suitable for printed circuit boards with an aspect ratio of 20:1；